ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,726, issued on April 14, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore). "Electronic fuse" was invented by Xinshu Cai (Si... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,726, issued on April 14, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore). "Electronic fuse" was invented by Xinshu Cai (Si... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,727, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor chip including low-k dielect... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,727, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor chip including low-k dielect... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,728, issued on April 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit (IC) die comprising galvanic isolation capac... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,728, issued on April 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit (IC) die comprising galvanic isolation capac... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,729, issued on April 14, was assigned to Microchip Technology Inc. (Chandler, Ariz.). "Devices including capacitor coupling power path to ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,729, issued on April 14, was assigned to Microchip Technology Inc. (Chandler, Ariz.). "Devices including capacitor coupling power path to ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,730, issued on April 14, was assigned to NATIONAL CENTER FOR ADVANCED PACKAGING Co. LTD. (Wuxi, China) and SHANGHAI XIANFANG SEMICONDUCTOR ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,730, issued on April 14, was assigned to NATIONAL CENTER FOR ADVANCED PACKAGING Co. LTD. (Wuxi, China) and SHANGHAI XIANFANG SEMICONDUCTOR ... Read More